ABSTRACT The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation they presented important and significant differences in their crystallographic textures and microstructures. Therefore, this study aimed to investigate the evolution of crystallographic texture of pure copper drawn at temperatures of 295 K and 77 K and correlated them to the deformation micromechanisms. For this, the X ray diffraction (XRD) and electron backscattered diffraction (EBSD) techniques were used. The results showed that, after the deformation, the samples drawn at both temperatures showed Copper {112}<111>, X {110}<111> and Brass {110}<112> components as the most intense. In samples drawn at cryogenic temperature there was also observed the appearance of a R{124}<211> component, typical of recrystallization and the presence of the γ fiber {111}<uvw>, typical of deformation twin.

Analysis of dislocation density in metallic materials has been pursued with great interest for many years because dislocations are closely associated with plastic deformation and thus exert a deep effect on the mechanical properties of any material. Crystallographic texture has also a decisive influence in some properties. In this work, the dislocation density was estimated from the line broadening of X-ray diffractograms using the Convolutional Multiple Whole Profile Program (CMWP) and crystallographic texture analyses were performed using inverse pole figures (IPF). The material used in this research was pure copper deformed by cold rolling and Equal Channel Angular Pressing (ECAP). The dislocation density values obtained by Transmission Electron Microscopy (TEM) and X-ray Diffraction (XRD) were compared and discussed. While, in the case of cold rolling, the crystallographic texture of the material was enhanced with increasing deformation, it was reduced with increasing deformation in the case of ECAP processing.